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semiconductor wafer germanium window high-resolution imaging systems
X-ray Photon Counting Imaging System - XIAMEN
2019-4-24u2002·u2002Germanium has semiconductor properties. High-purity germanium is doped with trivalent elements (such as indium, gallium, boron) to obtain P-type germanium semiconductors; and pentavalent elements (such as antimony, arsenic, and phosphorus) are doped to obtain N-type germanium semiconductors.
Get PriceAs-cut Germanium (Ge) Window for IR Transmission
2021-9-18u2002·u2002Germanium (Ge) Window Germanium (Ge) window is provided for infrared (IR) transmission. Ge window is not transparent for visible lingt and UV light while has a wide transmission range in infrared band. Infrared grade germanium single crystal is the basic material for making infrared lenses, infrared window and other optical components.
Get PriceOptical Grade Germanium for research and production -
2021-6-22u2002·u2002What are Optical Grade Germanium (Ge) Wafers? Germanium (Ge) is used in optical designs where a high index is required, such as for highly efficient infrared imaging. Germanium has proven to be an ideal material for a wide range of optical applications, from low-energy imaging to high-efficiency spectroscopy.
Get PriceWooptix - The ultimate image solutions
SEMICONDUCTOR METROLOGY Wavefront phase imaging is a new semiconductor metrology technique for measuring wafer geometry, capturing millions of datapoints in a few milliseconds with sub-nanometer height accuracy and higher spatial resolution than any other techniques. Benefits at a glance • 1.000 times faster than conventional techniques
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get PriceSemiconductor materials for x-ray detectors
Unlike most high-Z semiconductors, Ge is an elemental semiconductor, which is a great advantage for producing high-quality crystals. High-purity germanium (HPGe) single crystals are grown through the Czochralski process, Reference Depuydt, Theuwis and Romandic 7 with dimensions currently ranging up to about 100 mm in length and diameter.
Get PriceChina Germanium Co., Ltd. - Wafers, Optics
China Germanium Co., Ltd., Experts in Manufacturing and Exporting Wafers, Optics and 319 more Products.
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceJetStep W2300 System - Onto Innovation
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceOptical Grade Germanium for research and production -
2021-6-22u2002·u2002Germanium has proven to be an ideal material for a wide range of optical applications, from low-energy imaging to high-efficiency spectroscopy. In the range of 2 - 12 Wei m, germanium is one of the most widely used materials for the production of ball lenses and is also used for optical design where high indices are required. [Sources: 2, 3, 8]
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceWafer Inspection With SWIR Imaging
2021-9-29u2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. ... High resolution scans of complete wafers are often accomplished with line scan cameras at ...
Get PriceWafer Inspection Using SWIR Imaging
2 days agou2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. This is due to the bandgap of the molecules, which results in absorption of photons at ...
Get PriceA self-assembled microbonded germanium/silicon ...
Germanium is an attractive semiconductor utilized in many of the state-of-the-art electronic and optoelectronic devices. The hole mobility of Ge which is about 4 times greater than that of Si, which makes Ge an ideal candidate for fabricating high-speed electronics devices operated beyond 100 GHz 1.In addition, the ability of monolithically integrating Ge with Si using CMOS processes allows ...
Get PriceJetStep W2300 System - Onto Innovation
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
Get PriceSemiconductor Detector - an overview
Semiconductor detectors [germanium (Ge) and silicon (Si)] (see Chapter 7, Section B) created revolutionary advances in nuclear physics, nuclear chemistry, radiation chemistry, nondestructive materials analysis (e.g., x-ray fluorescence and neutron activation), and other fields. To date, however, they have had limited effect on nuclear medicine.
Get PriceJetStep S3500 System - Onto Innovation
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
Get PriceGermanium Wafers: 2019
2019-12-25u2002·u2002High quality local Germanium-on-oxide (GeOI) wafers are fabricated using selective lateral germanium (Ge) growth technique by a single wafer reduced pressure chemical vapor deposition system.Mesa structures of 300 nm thick epitaxial silicon (Si) interposed by SiO 2 cap and buried oxide are prepared. HCl vapor phase etching of Si is performed prior to selective Ge growth to remove a …
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get PriceWafer Inspection Using SWIR Imaging
2 days agou2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. This is due to the bandgap of the molecules, which results in absorption of photons at ...
Get PriceWafer Inspection With SWIR Imaging
2021-9-29u2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. ... High resolution scans of complete wafers are often accomplished with line scan cameras at ...
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceMonolithic integration of visible GaAs and near-infrared ...
2019-12-9u2002·u2002Monolithic integration of visible GaAs and near-infrared InGaAs for multicolor photodetectors by using high-throughput epitaxial lift-off toward high-resolution imaging systems Download PDF Article
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceA Low Dark Current and High Quantum Efficiency
A low noise, high quantum efficiency (QE) Ge photo diode was integrated in a standard 0.18 μm CMOS foundry process, enabling night imaging under moonless conditions in a high resolution CMOS ...
Get PriceSemiconductor Glossary : Hitachi High-Tech GLOBAL
Wafer. A wafer is a physical unit used for manufacturing semiconductor devices. In general, it is made by slicing a silicon ingot (a cylindrical mass) into disk-shaped pieces of about 0.5mm to 1mm thick. Usually, silicon wafers with a 5-inch (125mm) diameter, 8-inch (200mm) diameter and 12 …
Get PriceAn aluminum‐germanium eutectic structure for silicon
An aluminum-germanium eutectic bonding technology has been used to uniformly bond two silicon wafers for MEMS packaging at temperatures as low as 450 °C, well below the aluminum-silicon eutectic ...
Get PriceGermanium Wafers: 2019
2019-12-25u2002·u2002High quality local Germanium-on-oxide (GeOI) wafers are fabricated using selective lateral germanium (Ge) growth technique by a single wafer reduced pressure chemical vapor deposition system.Mesa structures of 300 nm thick epitaxial silicon (Si) interposed by SiO 2 cap and buried oxide are prepared. HCl vapor phase etching of Si is performed prior to selective Ge growth to remove a …
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get PriceWafer Inspection Using SWIR Imaging
2 days agou2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. This is due to the bandgap of the molecules, which results in absorption of photons at ...
Get PriceWafer Inspection With SWIR Imaging
2021-9-29u2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. ... High resolution scans of complete wafers are often accomplished with line scan cameras at ...
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceMonolithic integration of visible GaAs and near-infrared ...
2019-12-9u2002·u2002Monolithic integration of visible GaAs and near-infrared InGaAs for multicolor photodetectors by using high-throughput epitaxial lift-off toward high-resolution imaging systems Download PDF Article
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceA Low Dark Current and High Quantum Efficiency
A low noise, high quantum efficiency (QE) Ge photo diode was integrated in a standard 0.18 μm CMOS foundry process, enabling night imaging under moonless conditions in a high resolution CMOS ...
Get PriceSemiconductor Glossary : Hitachi High-Tech GLOBAL
Wafer. A wafer is a physical unit used for manufacturing semiconductor devices. In general, it is made by slicing a silicon ingot (a cylindrical mass) into disk-shaped pieces of about 0.5mm to 1mm thick. Usually, silicon wafers with a 5-inch (125mm) diameter, 8-inch (200mm) diameter and 12 …
Get PriceAn aluminum‐germanium eutectic structure for silicon
An aluminum-germanium eutectic bonding technology has been used to uniformly bond two silicon wafers for MEMS packaging at temperatures as low as 450 °C, well below the aluminum-silicon eutectic ...
Get PriceGermanium Wafers: 2019
2019-12-25u2002·u2002High quality local Germanium-on-oxide (GeOI) wafers are fabricated using selective lateral germanium (Ge) growth technique by a single wafer reduced pressure chemical vapor deposition system.Mesa structures of 300 nm thick epitaxial silicon (Si) interposed by SiO 2 cap and buried oxide are prepared. HCl vapor phase etching of Si is performed prior to selective Ge growth to remove a …
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get PriceWafer Inspection Using SWIR Imaging
2 days agou2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. This is due to the bandgap of the molecules, which results in absorption of photons at ...
Get PriceWafer Inspection With SWIR Imaging
2021-9-29u2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. ... High resolution scans of complete wafers are often accomplished with line scan cameras at ...
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceMonolithic integration of visible GaAs and near-infrared ...
2019-12-9u2002·u2002Monolithic integration of visible GaAs and near-infrared InGaAs for multicolor photodetectors by using high-throughput epitaxial lift-off toward high-resolution imaging systems Download PDF Article
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceA Low Dark Current and High Quantum Efficiency
A low noise, high quantum efficiency (QE) Ge photo diode was integrated in a standard 0.18 μm CMOS foundry process, enabling night imaging under moonless conditions in a high resolution CMOS ...
Get PriceSemiconductor Glossary : Hitachi High-Tech GLOBAL
Wafer. A wafer is a physical unit used for manufacturing semiconductor devices. In general, it is made by slicing a silicon ingot (a cylindrical mass) into disk-shaped pieces of about 0.5mm to 1mm thick. Usually, silicon wafers with a 5-inch (125mm) diameter, 8-inch (200mm) diameter and 12 …
Get PriceAn aluminum‐germanium eutectic structure for silicon
An aluminum-germanium eutectic bonding technology has been used to uniformly bond two silicon wafers for MEMS packaging at temperatures as low as 450 °C, well below the aluminum-silicon eutectic ...
Get PriceGermanium Wafers: 2019
2019-12-25u2002·u2002High quality local Germanium-on-oxide (GeOI) wafers are fabricated using selective lateral germanium (Ge) growth technique by a single wafer reduced pressure chemical vapor deposition system.Mesa structures of 300 nm thick epitaxial silicon (Si) interposed by SiO 2 cap and buried oxide are prepared. HCl vapor phase etching of Si is performed prior to selective Ge growth to remove a …
Get PriceMonolithic Metal–Semiconductor–Metal
2021-3-8u2002·u2002KEYWORDS: germanium, aluminum, metal-semiconductor heterostructure, solid state reaction, thermal annealing ... such as the Al-Ge system, enabling true metal-semiconductor heterostructures with ... cross-sectional high-resolution TEM image of the Al-Ge interface. The enlarged view in the HRTEM image in Figure
Get PriceWafer Inspection Using SWIR Imaging
2 days agou2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. This is due to the bandgap of the molecules, which results in absorption of photons at ...
Get PriceWafer Inspection With SWIR Imaging
2021-9-29u2002·u2002Imaging through semiconductor wafers and integrated circuit die for wafer defect inspection with InGaAs cameras is easy because semiconductor materials such as silicon and gallium arsenide are transparent in the short-wave infrared wavelength spectrum. ... High resolution scans of complete wafers are often accomplished with line scan cameras at ...
Get PriceDevelopment of super-resolution optical inspection
2006-10-18u2002·u2002Semiconductor design rules and process windows continue to shrink, so we face many challenges in developing new processes such as 300mm wafer, copper line and low-k dielectrics. The challenges have become more difficult because we must solve problems on patterned and un-patterned wafers. The problems include physical defects, electrical defects, and even macro defects, which can …
Get PriceMonolithic integration of visible GaAs and near-infrared ...
2019-12-9u2002·u2002Monolithic integration of visible GaAs and near-infrared InGaAs for multicolor photodetectors by using high-throughput epitaxial lift-off toward high-resolution imaging systems Download PDF Article
Get Price[PDF] DUV Optical Wafer Inspection System for 65-nm ...
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines.
Get PriceA Low Dark Current and High Quantum Efficiency
A low noise, high quantum efficiency (QE) Ge photo diode was integrated in a standard 0.18 μm CMOS foundry process, enabling night imaging under moonless conditions in a high resolution CMOS ...
Get PriceSemiconductor Glossary : Hitachi High-Tech GLOBAL
Wafer. A wafer is a physical unit used for manufacturing semiconductor devices. In general, it is made by slicing a silicon ingot (a cylindrical mass) into disk-shaped pieces of about 0.5mm to 1mm thick. Usually, silicon wafers with a 5-inch (125mm) diameter, 8-inch (200mm) diameter and 12 …
Get PriceAn aluminum‐germanium eutectic structure for silicon
An aluminum-germanium eutectic bonding technology has been used to uniformly bond two silicon wafers for MEMS packaging at temperatures as low as 450 °C, well below the aluminum-silicon eutectic ...
Get Price
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